TARGET MARKETS. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Mouser offers inventory, pricing, & datasheets for XCede High Speed/Modular Connectors. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. XCede ® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. 80 mm column pitch. Description Value; ECCN: EAR99. was founded in 1987 with the mission of becoming a specialty connector manufacturer, delivering highest quality products and providing unparalleled customer service. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 7. 40G QSFP+ to QSFP+ DAC Cable. Let’s take a look at a typical higher level motherboard for an example of connector and port types. Copper Weight and Annular Ring (“A/R”) 8 Table 3: XCede® HD 21. Please confirm your currency selection:Buy XCede HD Series Backplane Connectors. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. The PCIe bus, NC-SI bus, SMBus interface, various other sideband signals, and power are assigned to this connector. It’s as simple as choosing a base, a compatible arm, and a compatible device holder or adapter for your specific device. Secured form. These point loads may be caused by other beams, user input loads, or columns carried by the beam. Skip to content. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. English. 40G QSFP+ to QSFP+ AOC Cable. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. 4. Advanced Search. XCede® HIGHdPERFORMANCE BACKPLANE CONNECTOR. XCede HD achieves the highest performance in an HM compatible form factor. Revision SCR No. SCOPE Content This specification covers the performance, test and quality requirements for XCede product family interconnect systems. We offer interconnection systems from 2. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. RAM Steel Beam Design calculates the number of studs required, accounting for the locations of maximum moments and zero moments and special distributions required due to the presence of point loads. 062") thick cards. 2. 28G ADDITION TO THE XCEDE ® HD FAMILY XCede ® HD plus leverages the same. 4、6或8列. Send us a Message. Pitch (mm): Mated Height (mm): Circuits: Current (MAX): 2. 3、4和6对设计. Revision “D” Specification Revision Status . High Speed / Modular Connectors XCede HD High-Density Backplane Custom Right-Angle Module BSP-226769-01; Samtec; 1: $29. 1. Amphenol TCS XCede Backplane Connectors feature up to 82 differential pairs as well as 2-, 3-, 4-, 5-, and 6-pair configurations. Brand of Product：Amphenol ICC,Part#：946-230X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. KK connector systems are customizable for a variety of power and signal applications. Integrated power, guidance, keying and side walls available. Designed to meet UL 1977 CAF (Conductive Anodic Filament) spacing Housing: High-temperature thermoplastic, UL94-V0 Wafers: High-temperature thermoplastic, UL94-V0 Contacts: High-performance copper alloy Platings. 2. DC Connector Configurations XCede HD connector system. 1 XCede HD , XCede HD PLUS & XCede HD2 Daughtercard Customer Use Drawings 2. challenging architectures. 8 mm column pitch representing a 35% increase versus XCede®. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. XCede High Speed/Modular Connectors are available at Mouser Electronics. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. XCede HD achieves the highest performance in an HM compatible form factor. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Article: 00229048. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. 10120130-Y0J-20DLF Datasheets | Backplane Connectors Connector Header, Male Pins and Blades Through Hole Black XCede®, Guide Right By apogeeweb, 10120130-Y0J-20DLF, 10120130-Y0J-20DLF Datasheet,10120130-Y0J-20DLF PDF,Amphenol ICC (FCI)XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Nov 13, 2019. use keep out zone. Login or REGISTER Hello, {0}. TARGET MARKETS. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Login or REGISTER Hello, {0}. The XCede ® HD Plus backplane connector achieves high . XCede HD achieves the highest performance in an HM compatible form factor. Backwards mate compatibility. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. XCede® connectors also address. They are available in 1. 4. 0 REFERENCE 2. XCede® Stacker. Brand of Product：Amphenol ICC,Part#：947-4XXX-XXX,Product Category：XCede RAM SIGNAL WAFER,Data. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. Contact Mouser (USA) (800) 346-6873 | Feedback. com. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. 3A per pin current rating and mount individually to the backplane. Login or REGISTER Hello, {0}. Login or REGISTER Hello, {0}. § Differential pairs 28-84 per inch (11-33 differential pairs perBack view of 24 x 2. XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). 2. REPAIR PROCEDURE FOR MODULE SEE TB-2217. If you use the QSFP transceivers in the QSFP28 100G port, keep in mind that you have both single-mode and multimode (SR/LR) optical transceivers and Twinax/AOC options that are. Login or REGISTER Hello, {0}. MTP to 4x LC breakout cable is composed of an 8-fiber MTP connector for 40G QSFP+ at one end and 4 duplex LC connectors for 10G SFP+ at the other end. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®. 2. XCede® HD combines a small form factor with incredible design flexibility for significant board and system space savings. XCede® connectors also address. 2" long and has an x4 connector. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane interconnect systems. 20mm Power Modules. Free shipping on many items | Browse your favorite brands | affordable prices. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. EN. Check Pricing. 1. 1. A Loyalty Bonus Cash of $1,500 (applied after taxes) is offered on all new 2022 Ram 1500 Classic models and applies to current and original owners of a Chrysler, Dodge, Jeep,. Lukin 08/19/13 “B” S2483 Update Max force per pin spec E. 3. We would like to show you a description here but the site won’t allow us. 0 REFERENCEDOCUMENTS 2. XCede® Connectors - Amphenol CS | DigiKeyAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Improves signal integrity and increases signal. 00mm pitch (FF5026) and 050mm pitch (FF3025). Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions, which enable companies to innovate and grow. challenging architectures. Three levels of sequencing enable hot plugging. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . refer to c-922-4x0a-500 for signal connector detail. 1. For XCede HD RAM. XCede® connectors also address. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Skip to Main Content (800) 346-6873. 5. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). Login or REGISTER Hello, {0}. 1. 1. As a high-density, high-speed backplane connector, the XCede ® HD product line provides a robust solution for tighter card pitches and chassis designs where space requirements and. 3. Available in straddle mount, through-hole termination and also SMT. a SFP+ adapter that's super-short 3. Skip to Main Content (800) 346-6873. Board-to-board connector / rectangular / SMT. 2. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. The vertical header range also includes. Get the best deals on Amphenol Backplane Connectors Connectors when you shop the largest online selection at eBay. Make your own RAM ® Mount or use RAM ® Mounts components to build a custom mount. Amphenol is the leader in high-speed, high-density connection systems, designing and manufacturing the industry's leading connectors and backplane systems. See Figure 15 for details. 3. Login or REGISTER Hello, {0}. Change Location. 4. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. They're small enough for most consumer RF applications and they use a threaded housing to create strong mechanical connections. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 00 mm contact wipe on signal pins. Check Pricing. We are excited to announce the completion of a merger with TechStream and Etonwood as of Friday the 17th of January 2020. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. The. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 11. Accessories; Audio Products; Capacitors; Circuit Protection; Circuit Breaker Protection Devices ExplainedDislaime Please note that the above information is subject to change without notice. 1 DOCUMENTS 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Click OK to extend your time for an additional 30 minutes. See section 4 regarding XHD2 RAM connectors. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. Features. 0 REFERENCE 2. Buy XCede HD Plus Series Backplane Connectors. Features. 1. Choice of 2 or 4 power banks. 1. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Login or REGISTER Hello, {0}. 0 REFERENCE 2. Dislaime Please note that the above information is subect to change without notice. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contactAmphenol's Flat Flexible Cable (FFC) Jumpers are available in a wide range of standard cable lengths to meet the wide range of flexible interconnect requirements between two PC boards. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. The 0. DETAILS. DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY While maintaining the same mating. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho. These connectors are two-piece devices that connect two printed circuit boards. 1. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. These connectors are two-piece devices that connect two printed circuit boards. com. Connector, XCede HD Series, 100 Contacts, 1. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. Lukin 10/01/13 “C” “D”. Get a Free Sample. 2. Contact Mouser (Bangalore) 080 42650011 | Feedback. jx410-51594 rev drawing no. 8 mm column pitch representing a 35% increase versus XCede®. Amphenol Xcede Series High Speed / Modular Connectors are available at Mouser Electronics. 2. 2. Signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. XCede ® HD is a small form factor system with a modular design for significant space savings and. The XCede HD connector. The XCede ® I/O interconnect system is comprised of a 32 position, variable pitch connector built for use in high speed serial applications. $ 129. Separate the interface from 40G to four 10G. XCede® connector family. screw length and part number are dependent on daughtercard thickness (as specified from configurator). Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 3. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 4, Gen. Login or REGISTER Hello, {0}. Commercial Standards 2. 4. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. These connectors are ideal for meeting a wide variety of application needs, including Ethernet and PCI. High Speed Cables & Connectors; HDTF - Samtec XCede® HD 1. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Same mechanical benefits as backplane connectors; High pin counts, blind mate & high density; Low loss twin ax cable; Overcomes limitation of PCB materials; Linear transmission to ~30 GHz; Enables 25G NRZ and 56G PAM4; Flexible pin out; Allows for full mesh designs with cable harnesses; 30 - 26 AWG wire gauges; Optimization of transmission. Three levels of sequencing enable hot plugging. 80mm Right-Angle Backplane Receptacle (HDTF). 三个等级的上电次序实现了热插拔. It is intended to provide general guidance for development of customer designs It is intended to provide general guidance for development of customer designs and application processes as they relate to this product family. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. 2 Pair. Your Price. 2-, 3-, 4-, 5-, 6-Pair configurations. XCedeHD RAM and XCede HD Inverted RAMrefer to. +44 (0)203 301 9900. XCede Daughter Card PWB + Fixture Thickness Requirements and Compliant Pin Protrusion Lengths XCede Connector Type/Size PWB + Fixture Thickness Minimum (mm) 0. XCede® connectors also address. Buy XCede HD Series Backplane Connectors. 3. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service. The XCede HD2 connector family consists of modular configurations with custom power and guidance modules. See section 4 regarding XHD2 RAM connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 2. We chose the Asus Prime X470-Pro for its inclusion of many modern. Login or REGISTER Hello, {0}. DC configurations may also be determined by the XHD+ RAM connector to which they will mate for co-planar applications. Applications. Mouser offers inventory, pricing, & datasheets for Samtec XCede High Speed / Modular Connectors. ExaMAX® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. 3. Samtec’s Eye Speed® ultra low skew twinax cable provides increased flexibility and routability. Across our key areas, our experts operate with a. We would like to show you a description here but the site won’t allow us. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. 08mm pitch sizes, this single-row, wire-to-board and board-to-board product family is cost effective and versatile. 65; 29 In Stock; New Product; Mfr. 1 XCede HD 2 Pair Backplane With Extra Ground Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick WallXCede® HD backplane connector achieves high performance (up to 20Gb/s) in a hard metric form factor. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Search for: Search Home; Categories. ENABLING FUTURE DATA RATES While maintaining the same mating interfaces, this connector design provides. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. Buy Amphenol JX41051436 in Avnet APAC. 3. 1. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Download M12 PCB MOUNT CONNECTOR, X-CODED, FEMALE. Integrated power and guidance. refer to tb-2235 for xcede hd product specifications. 2. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. PDF 957-4100-AXX 4 PAIR POWER. high speed performance, paddle card edge connector series for next Gen. Login or REGISTER Hello, {0}. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. 1. Combination signal and power edge card system with rugged Edge Rate® contacts and performance up to 60 A per power bank. XCede ® HD is a small form factor system with a modular design for significant space savings and. 1. Wang 2/18/16 C S7764 Updated document title, Added XCede HD2 backplane information B. 2. This merger brings together three specialist technology talent solution companies that creates a group with £100m revenue, 650 onsite contractors and 220 internal employees across 9 global offices. We would like to show you a description here but the site won’t allow us. XCede® HD是一个采用. TARGET MARKETS. Available in industry-standard 2. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2. BENEFITS. Motherboard Diagram. . Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. 3. XCede® connectors also address. see tb-xxxx for board weight limitations. - FCI. 2 Host Interface Connector The BCM957504-N425G OCP network adapter interfaces with the system baseboard via the gold fingers compliant with the SFF-TA-1002 specification. These modules consist of a 12. Complementary guide and power modules are also included in the product range. These connectors are two-piece devices that connect two printed circuit boards. 3. • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Accessories; Audio Products; CapacitorsAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. by Xcede. This was soon replaced by DIMM with a 64-bit data path. 3-, 4- and 6-pair designs. Amphenol is one of the leading manufacturers of Backplane connectors. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). 4. signal connector (J_BP_SIG) 5. Available with 40, 60 and 80 signal pins. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. 54mm pitch down to 0. Specs Kit. 2 The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal, right-angle-male Amphenol Communications Solutions XCede high-performance backplane connector system. 1. 1. 27 - 12. Complementary guide and power modules are also included in the product range. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 2. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Buy XCede HD Series Backplane Connectors. The types of memory modules available today can be broadly classified into Single In-Line Memory Module (SIMM) and Dual In-Line Memory Module (DIMM). These connectors are available in 3-, 4- and 6-Pair configurations. . XCede® connectors also address. Power blades rated up to 60 A per power bank. power connector (J_PWR_A) 6. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Revision “F” Specification Revision Status . XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. XCede® Connectors - Amphenol CS | DigiKeyFounded in 2003, our vertical specialists provide global transformational talent in data, product, software, cloud and cyber. XCede® connectors also. 4, 6 or 8 columns. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. DETAILS. 2. 2. 1.